SAN FRANCISCO – On October 12th SCSI Trade Association (STA) introduced the new Serial Attached SCSI (SAS) Advanced

Connectivity Roadmap which previewed the connectivity advances to support future SAS growth in the enterprise. The new SAS connectivity benefits will apply to mid-range and large data centers and will improve all aspects of connectivity and ease of operation.

As an important part of the announcement, STA is promoting a converged Mini-SAS High-Density (HD) standard connector to create a vibrant and consistent infrastructure to expand SAS usability and scalability. The STA objectives include a consistent connectivity management scheme in addition to the active copper and optical cable extensions supported by the new Mini-
SAS HD connector. Harry Mason, President of STA and Director of Industry Marketing at LSI, commented, “Larger SAS deployments may support upwards of a thousand drives, require multiple levels of cascaded SAS expanders and often utilize centralized SAS switching elements. This level of SAS scaling demands more from SAS as a system-level interconnect. STA is advancing and standardizing SAS connectivity architecture to position SAS to meet the scalability needs of the targeted markets.”

To meet future requirements, STA’s objective is to drive market consistency by simplifying cable and connector options and by providing connectivity management standards designated as SAS Connectivity Management. High-density connectivity with support for active copper connections up to 20m and optical connections up to 100m, will vastly improve SAS flexibility
and usability. The new connectivity standards are also extensible to the coming 12Gb/s SAS generation. To achieve these objectives, STA will drive connectivity convergence centered on the new Mini-SAS HD connector. This versatile connector contains electrically improved signaling at 6Gb/s data rates and will support data scaling to 12Gb/s. The Mini-SAS HD connector doubles the port density of the currently available Mini-SAS connector, comes in a variety of port sizes, and offers internal and external connector options. In addition, it supports a standard method of powering the connector for either active copper or optical links. SAS Connectivity Management is an integral part of the advances being made as it supports connection discovery and cable management. It detects passive and active copper and optical connections and eliminates the need for mechanical keys.

The goals of SAS Connectivity Management include improved serviceability and reliability, as well as lower total cost of ownership (TCO). SAS is rapidly evolving to meet the performance, scalability and usability needs of tomorrow’s storage environments. SAS will grow and thrive, in part, because of the Advanced Connectivity roadmap, which offers a solid connectivity scheme based on the versatile Mini-SAS HD connector in addition to SAS Connectivity Management support. The SCSI Trade Association was established in 1995 to provide a focal point for members to communicate the benefits of SCSI to the industry. STA promotes the understanding and use of Serial Attached SCSI (SAS) technology and influences the evolution of SAS standards to meet future storage industry needs. The Association has a nine-member Board of Directors which oversees the Marketing Communications and Technology Committees and all STA activities. For more information, please visit the STA website at www.scsita.org

SCSI Trade Association Members include:

Amphenol. – Amphenol is a worldwide manufacturer of serial and parallel SCSI interconnect devices, including cable, connectors, terminators, and cable assemblies. Key new product include “Opticlear” Ultra 320 SCSI, a flexible, round mass termination solution, and single/multiport SATA/ SAS cables for next generation storage and server applications. Amphenol is also a leading supplier of InfiniBand, FibreChannel, and 10Gb interconnect hardware.www.spectra-strip.com

Intel Corporation – For more than three decades, Intel Corporation has developed technology enabling the computer and Internet revolution that has changed the world. Founded in 1968 to build semiconductor memory products, Intel introduced the world’s first microprocessor in 1971. Today, Intel supplies the computing and communications industries with chips, boards, systems, and software building blocks that are the “ingredients” of computers, servers and networking and communications products. These products are used by industry members to create advanced computing and communications systems. Intel’s mission is to be the preeminent building block supplier to the Internet economy. www.intel.com

LSI Corporation – For more than 20 years, LSI has been a leading provider of storage component products, storage systems and ASIC technology that speed and solve enterprise server, network and workstation storage needs. Today, the company provides unique high-performance solutions using Fusion-MPT (Message Passing Technology) architecture across all interfaces. LSI was first-to-market with Ultra320 SCSI products and sells to all leading OEMs and to the Channel using distribution partners and resellers worldwide. LSI’s customers can also take advantage of the company’s unique CoreWare® methodology to increase performance, lower system costs and accelerate time to market. The CoreWare design methodology includes a library of high-level, industry-standard building blocks such as microprocessors, networking controllers, digital signal processors and video compression engines. These IP building blocks – “cores” – are connected together electronically to form an entire system on a single chip. Key product lines include: Ultra320 SCSI, Serial Attached SCSI, Fibre Channel host bus adapters, MegaRAID SCSI, iSCSI and SATA storage adapters, and iMegaRAID controllers. For more information about LSI, visit: www.lsi.com

Marvell Semiconductor – Marvell is the market and technology leader in storage, communications and consumer silicon solutions. The company’s diverse product portfolio includes switching, transceiver, communications controller, wireless, and storage solutions that power the entire communications infrastructure, including enterprise, metro, home, and storage networking. www.marvell.com

Molex – the world’s second-largest manufacturer of electronic, electrical and fiber optic interconnection products and systems. We also make a variety of switches and application tooling. As a one-source supplier, we assure worldwide coordination of our resources to meet our customers’ needs globally, regionally and locally. In product development centers, manufacturing facilities and sales offices on six continents, the more than 16,241 people of Molex are 100 percent customer
driven. This dedication has kept us one of the fastest growing companies in our industry since we opened our doors in 1938. www.molex.com

Seagate Technology is a leading provider of technology and products enabling people to store, access and manage information. Seagate is committed to providing best-in-class products to help people get their information when, where and how they want it. Seagate is the world’s largest manufacturer of disc drives, magnetic discs and read-write heads, an innovator in tape drives, and a leading developer of software for information availability, access and analysis. Seagate can be found around the globe and the World Wide Web at  www.seagate.com

Toshiba America Information Systems – Toshiba is a one-of-a-kind comprehensive storage company, offering hard disk drives (HDDs), optical disk drives (ODDs), solid state drives (SSDs) and NAND flash memories – technologies that drive a wide range of consumer electronics, computer and automotive applications as well as customer-focused enterprise solutions for the global marketplace. Through its Storage Device Division (SDD), Toshiba is a leader in delivering pioneering HDDs that enable superior form and functionality in a wide range of products from retail and mobile to enterprise applications. Toshiba’s HDD design, development, manufacturing, sales and other infrastructure functions solidify the company’s brand as a long-term premier global data storage company. Leveraging the benefits of global product development and manufacturing, Toshiba is empowered to provide innovative products to enterprise, mobile and retail customers with high-performance HDDs through its established clientele of PC and consumer electronics equipment manufacturers, consumer electronics manufacturers, automotive manufacturers and after-market suppliers, distributors, resellers, systems integrators and retailers around the world. For more information, visit: www.toshiba.com

Tyco Electronics – Tyco Electronicsis one of the major business segments of Tyco Internation Ltd. (NYSE: TYC, LSE: TYI, BSX: TYC). Tyco Electronics is the world’s largest passive electronics components manufacturer; a world leader in cutting-edge wireless, active fibre optc and complete power systems technologies; and is also rapidly developing extensive networking and building technology installation services. Tyco Electronics provides advanced technology products from over forty well-known and respected brands, including Agastat, Alcoswitch, AMP, AMP NETCONNECT< Buckanan, CII, CoEv, Critchley, Elcon, Elo, Touch Systems, MIA-COM, MADISON CABLE< OEG, OneSource Building Tecnologies, Potter & Brumfield, Raychem,  Schrack, Simel and TDI Batteries. World Wide Web at  www.tycoelectronics.com

(source www.scsita.org – All trademarks are the property of their respective owners.-pv-)

Under the terms of the definitive agreements, NMD will become a joint venture, 60% owned by the existing shareholders of NMD, 30% by Amkor and 10% by Toshiba, and it will change its name to J-Devices Corporation (“J-Devices”).

Under the definitive agreements, the following equipment and operations will be transferred to J-Devices: the back-end process business, including technology development, at Toshiba LSI Package Solutions Corporation (“TPACS”), a Japan-based semiconductor packaging company wholly owned by Toshiba; the system LSI and memory back-end process equipment at TPACS’ Oita Works and Fukuoka Works; and certain wafer probing equipment installed at Toshiba’s Oita Operations. TPACS’ employees working for the transferred business will engage in the same business at J-Devices.

Amkor is expected to invest approximately 1.5 billion JPY (approximately $17 million) in J-Devices and to purchase certain assembly and test equipment from Toshiba for about 4.0 billion JPY (approximately $45 million) and lease such equipment to J-Devices. Toshiba is expected to invest approximately 0.5 billion JPY. In addition, Amkor will have the right to acquire a majority interest in J-Devices in 2012.

J-Devices aims to become a leading provider of semiconductor assembly and test services in Japan by combining the benefits of NMD’s low-cost operations, Amkor’s manufacturing expertise and global materials and component procurement capabilities, and Toshiba’s cutting-edge technology and know-how.

The closing under the definitive documents is subject to customary closing conditions, including receipt of debt financing.

Outline of J-Devices Corporation (expected upon closing)
Location: 1913-2, Fukura, Usuki City, Oita Prefecture, Japan
President and CEO: Yoshifumi Nakaya
Start of Operation: October 31, 2009 (scheduled)
Ownership: 60% by existing shareholders of NMD, 30% Amkor and 10% Toshiba
Stated Capital: 1,770 million yen (pro forma as of October 31, 2009)
Employees: Approximately 2,000
Business: Semiconductor assembly and testing services

About Nakaya

Founded in 1970 in Oita, Japan, Nakaya Microdevices Corporation has served as an independent provider of semiconductor assembly and test services for nearly 40 years. More information is available in Japanese at http://www.nakaya-md.co.jp/

About Amkor

Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company’s SEC filings and on Amkor’s website: www.amkor.com.

About Toshiba

Toshiba is a world leader and innovator in pioneering high technology, and a diversified manufacturer and marketer of advanced electronic and electrical products spanning information & communications systems; digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances.

Toshiba was founded in 1875, and today operates a global network of more than 730 companies, with 199,000 employees worldwide. Visit Toshiba’s web site at www.toshiba.co.jp/index.htm

NMD
Disclaimer:

This press release contains forward-looking statements concerning future plans, strategies and the performance of Nakaya Microdevices Corporation. These statements are based on management’s assumptions and beliefs in light of the economic, financial and other data currently available. Furthermore, they are subject to a number of risks and uncertainties. Nakaya therefore wishes to caution readers that actual results might differ materially from our expectations. Major risk factors that may have a material influence on results are indicated below, though this list is not necessarily exhaustive.

* Disputes including lawsuits in Japan and other countries;
* Success or failure of alliances or joint ventures promoted in collaboration with other companies;
* Success or failure of new businesses or R&D investment;
* Changes in political and economic conditions in Japan and abroad; unexpected regulatory changes;
* Major disasters, including earthquakes and typhoons;
* Rapid changes in the supply/demand situation in major markets and intensified price competition;
* Significant capital expenditure for production facilities and rapid changes in the market;
* Changes in financial markets, including fluctuations in interest rates and exchange rates.

Amkor
Forward-Looking Statement Disclaimer

This press release contains forward-looking statements within the meaning of U.S. federal securities laws. All statements other than statements of historical fact are considered forward-looking statements including, without limitation, statements regarding the establishment, structure, content and performance of the joint venture. These forward-looking statements involve a number of risks, uncertainties, assumptions and other factors that could affect future results and cause actual results and events to differ materially from historical and expected results and those expressed or implied in the forward looking statements, including, but not limited to, the following: the closing of the joint venture is subject to receipt of debt financing and any necessary government approvals and the other closing conditions contained in the definitive agreements; and the performance of the joint venture will depend on the parties’ ability to successfully integrate and manage their contributions to the venture. Other important risk factors that could affect the outcome of the events set forth in these statements and that could affect the operating results and financial condition of the joint venture or Amkor are discussed in Amkor’s Annual Report on Form 10-K for the year ended December 31, 2008 and in Amkor’s subsequent filings with the Securities and Exchange Commission made prior to or after the date hereof. Amkor undertakes no obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this press release.

Toshiba
Disclaimer:

This press release contains forward-looking statements concerning future plans, strategies and the performance of Toshiba Group. These statements are based on management’s assumptions and beliefs in light of the economic, financial and other data currently available. Furthermore, they are subject to a number of risks and uncertainties. Toshiba therefore wishes to caution readers that actual results might differ materially from our expectations. Major risk factors that may have a material influence on results are indicated below, though this list is not necessarily exhaustive.

* Disputes including lawsuits in Japan and other countries;
* Success or failure of alliances or joint ventures promoted in collaboration with other companies;
* Success or failure of new businesses or R&D investment;
* Changes in political and economic conditions in Japan and abroad; unexpected regulatory changes;
* Major disasters, including earthquakes and typhoons;
* Rapid changes in the supply/demand situation in major markets and intensified price competition;
* Significant capital expenditure for production facilities and rapid changes in the market;
* Changes in financial markets, including fluctuations in interest rates and exchange rates.

Contacts:
Nakaya Microdevices Corporation
Keitaro Kai
TEL: +81-(50)3161-4938
e-mail: keitaro.kai@nakaya-md.co.jp Amkor Technology, Inc.
Joanne Solomon
Corporate Vice President & Chief Financial Officer
TEL : +1 480 821 5000 Extension 5416
email: joanne.solomon@amkor.com Toshiba Corporation
Corporate Communications Office
+81-(3)3457-2105

http://www.toshiba.co.jp/contact/media.htm

(source www.amkor.com)